The conference will be held in Changsha, China from August 25 to 27, 2027, focusing on the frontier field of "Silicon Photonics and Computational Imaging". The conference features two major tracks: Silicon Photonics and Computational Imaging, along with a joint special session track. It will delve into key technical issues such as silicon-based photonic devices and heterogeneous integration, microwave photonics and on-chip optical computing, computational imaging theory and systems, single-pixel and 3D imaging, spectral and biomedical imaging, and integrated LiDAR and fiber-optic distributed sensing. Through keynote speeches, oral presentations, and poster sessions, the conference aims to showcase the latest research achievements, promote collaborative innovation between fundamental research and industrial applications, and establish a high-level academic exchange and cooperation platform. We sincerely welcome experts, scholars, and technical professionals from universities, research institutions, and enterprises worldwide to actively participate and exchange ideas
Conference Starts In
Accepted papers will be submitted for indexing in EI Compendex and Scopus.
Please mark your calendar with the following key deadlines for ICSPCI 2027.
All papers related to the theme of Silicon Photonics and Computational Imaging can be submitted, including but not limited to the following topics:
Silicon-based Photonic Devices and Materials
Photonic Integrated Chips and Heterogeneous Integration
Optical Fiber Technology and Fiber Sensing
Optical Transmission Systems and Technologies
Optical Transceiver Modules and Optical Interconnects
Optical Networks and Optical Switching Technologies
Optical Access Networks and Systems
Microwave Photonics and Optoelectronic Fusion
Space Optical Communication and Communication Terminals
Silicon Photonic Phased Arrays and LiDAR
On-chip Optical Signal Processing and Optical Computing
Computational Imaging Theory and System Design
Computational Photography and Computational Cameras
Single-pixel Imaging and Lensless Imaging
Light Field Imaging and 3D Imaging
LiDAR and Remote Sensing Imaging
Spectral Imaging and Computational Spectrometers
Phase Imaging and Computational Holography
Computational Microscopy and Biomedical Imaging
Scattering Imaging and Non-line-of-sight Imaging
Event Cameras and Single-photon Imaging
Industrial Imaging and Optical Inspection
J1 Integrated Phased Arrays and Solid-state LiDAR Imaging
J2 On-chip Computational Spectroscopy and Integrated Coherent Imaging
J3 Fiber Imaging and Distributed Intelligent Sensing
The full text of each submitted paper will undergo three technical reviews, which include initial review, double-blind peer review (at least three review experts), and final review. The submission will be evaluated on the originality of the content, technical and research content/depth, correctness, relevance to the conference, contribution and readability.
Beijing Zhonghuan Institute of Electric Power and Energy Big Data
International Association For Energy And Environmental Research